With demand for semiconductor chips continuing to surge, fabricators are seeking ways to improve operational efficiency and increase output. To achieve these goals, KUKA Robotics will spotlight, during the Semicon West show, July 12-14, a mobile robotic solution developed in partnership with the world's largest semiconductor fabricators that reliably transfers materials in areas unsuitable for traditional automated material handling systems. 

Visitors to Booth #250 will experience the first of its kind KUKA mobile robotic wafer-handling system for human/machine collaboration. It offers an ideal solution for material transport of 200mm or 300mm wafer boxes and SMIF boxes, open cassette machine loading and unloading.

The system combines a KUKA LBR iiwa 14 R820 CR robot mounted on one of the company's KMP 200 CR automated mobile platforms. Both the robot and mobile platform are cleanroom class ISO 3 rated and feature advanced safety and navigational functionality.

As a seven-axis robot, the LBR iiwa 14 R820 CR handles payloads up to 14kg and has no external cabling for obstruction-free operation. The mobile platform is outfitted with KUKA’s omnidirectional wheel technology for maximum flexibility and high-precision movement.

For simplicity and ease of use, the solution is completely integrated with one controller for the robot, platform and navigation as well as one software solution for all three. Safety functions include laser scanning and safety warning/safety stop fields, among others.