Siemens Digital Delivers Hardware-Assisted Verification System

Siemens Digital Industries Software recently unveiled its next-generation Veloce hardware-assisted verification system for the rapid verification of highly sophisticated, next-generation integrated circuit (IC) designs. 

Products include:

Veloce HYCON (HYbrid CONfigurable) for virtual platform/software-enabled verification. Veloce HYCON delivers innovative technology that allows customers to engineer and deploy complex hybrid emulation systems for their next-generation system-on-chip (SoC) designs.

Veloce Strato+, a capacity upgrade to the Veloce Strato hardware emulator. With an industry-leading capacity roadmap that scales up to 15 billion gates, Veloce Strato+ combines the industry’s highest total throughput with its fastest co-model bandwidth and time-to-visibility.

Veloce Primo for enterprise-level FPGA prototyping, an internally developed enterprise prototyping solution that combines industry-leading runtime performance with exceptionally fast prototype bring-up.

Veloce proFPGA for desktop FPGA prototyping. With a modular approach to capacity, the Veloce proFPGA family of products delivers scalability across a range of capacity requirements.

“As we enter the new semiconductor mega-cycle, the era of software-centric SoC design requires a dramatic change in functional verification systems to address new requirements,” said Ravi Subramanian, senior vice president and general manager, Siemens EDA. “The introduction of the next-generation Veloce system that addresses these key new requirements is a direct result of the focused investment from Siemens to offer our customers a complete, integrated system with a clear roadmap for the next decade. With this announcement, we are establishing a new standard for a system that is capable of supporting the new verification requirements across a diverse set of industries-spanning computing and storage, AI/ML, 5G, networking, and automotive.”

“The advanced technology found in the proFPGA family delivers many advantages for validating today’s AI/ML, 5G, and data center ASIC designs,” said Gunnar Scholl, CEO of Pro Design. “We are excited to partner with Siemens. “Our collective experience, insight and strategy for the FPGA desktop prototyping market is being recognized, and we are excited to accelerate market penetration in this space through the collaboration with Siemens.”