The kick-off meeting and implementation plan review for the key special project "Key Technologies of Porous High-Stability Precision Aerostatic Bearings" was successfully held

On May 23 2025， the launch and implementation plan demonstration meeting of the key project "Key Technology of Porous High Stability Precision Air Bearings" of the key special project of the National Key R&D Program "High-Performance Manufacturing Technology and Major Equipment" was successfully held at Hunan University. The project was led by Hunan University and jointly undertaken by Beijing China Electronics Technology Electronic Equipment Co., Ltd., Beijing University of Aeronautics and Astronautics, University of Science and Technology Beijing, Luoyang Bearing Research Institute Co., Ltd., Henan Five Star New Materials Technology Co., Ltd., Guangzhou Haozhi Electromechanical Co., Ltd., and Harbin Institute of Technology (Shenzhen).

Project responsible experts Liu Qianjun, Secretary General of China Machinery Industry Federation, and Professor Yao Jianyong of Nanjing University of Science and Technology; project technical experts Professor Zhang Chenhui of Tsinghua University, Professor Yang Shuming of Xi'an Jiaotong University, Professor Fan Dapeng of National University of Defense Technology, Professor Jiang Ping of Huazhong University of Science and Technology, and Wu Dongxu, Deputy Chief Engineer of Machine Tool Engineering Research Institute Co., Ltd. of General Technology Group attended the meeting. Gong Xun, Director of Science and Technology Department of Hunan Provincial Department of Industry and Information Technology, Li Jian, Deputy Director of Hunan University Institute of Science and Technology, Liu Xidong, Secretary of the Party Committee of School of Mechanical and Transportation Engineering, Han Xiaoxiao, Vice Dean, Feng Kai, Project Leader, and more than 30 people including project leaders and project backbones attended the meeting.

Li Jian delivered a speech on behalf of Hunan University, welcoming and thanking all leaders and experts for their arrival. As the leading unit of the project, Hunan University will fully support and actively cooperate with the project management organization, earnestly perform the responsibilities of the leading unit and the main responsibilities of the legal person unit, and make every effort to promote the project and ensure the high quality and timely completion of the project.

Gong Xun said that the project meets the national strategic needs and is of great significance to improving my country's independent innovation capabilities in core components of high-end equipment. It is hoped that the project team will focus on core technology breakthroughs, standardize project management, ensure high-quality completion of R&D goals, and help promote the high-quality development of my country's high-end equipment manufacturing industry.

Professor Feng Kai, the project leader, introduced the overall situation of the project. He formulated a reasonable and feasible implementation plan around the development task of the spindle of the third-generation semiconductor high-precision, high-quality and high-efficiency thinning and polishing machine. He implemented detailed research plans and methods for key scientific and technological issues at the levels of suspension mechanism, design theory, system integration, etc., and will eventually form an innovative capability covering the entire chain of pore realization-axis system development-application verification, and build a high-performance air-floating spindle and air-floating stage technology system for thinning and polishing machines.

The leaders of each project gave a detailed explanation of the project goals and tasks, implementation paths, research progress, and assessment indicators.

The experts at the meeting fully affirmed the urgency of the project in the semiconductor field, and unanimously recognized the overall goals and technical routes, agreed to pass the demonstration of the project implementation plan, and the expert group also provided comprehensive guidance on the subsequent high-quality implementation of the project. The project team stated that it will make every effort to promote technical research and organizational implementation, inject new momentum into the innovative development of high-end equipment in my country's semiconductor field, and help the independent control of high-end equipment and the construction of major national projects.